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TPCC8105 Datasheet(PDF) 2 Page - Toshiba Semiconductor |
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TPCC8105 Datasheet(HTML) 2 Page - Toshiba Semiconductor |
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2 / 7 page ![]() TPCC8105 2010-09-03 2 Thermal Characteristics Marking Note 1: Ensure that the channel temperature does not exceed 150°C. Note 2 a: Device mounted on a glass-epoxy board (a) Note 2b: Device mounted on a glass-epoxy board (b) Note 3: VDD = −24 V, Tch = 25°C (initial), L = 200 μH, RG = 1 Ω, IAR = −23 A Characteristic Symbol Max Unit Thermal resistance, channel to case (Tc = 25°C) Rth(ch-c) 4.16 °C/W Thermal resistance, channel to ambient (t = 10 s) (Note 2a) Rth(ch-a) 65.7 °C/W Thermal resistance, channel to ambient (t = 10 s) (Note 2b) Rth(ch-a) 178 °C/W (a) FR-4 25.4 × 25.4 × 0.8 (Unit: mm) (b) FR-4 25.4 × 25.4 × 0.8 (Unit: mm) Part number 8 105 Lot No. Product-specific code |
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