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TPCC8105 Datasheet(PDF) 3 Page - Toshiba Semiconductor

Part # TPCC8105
Description  Lithium Ion Battery Applications Power Management Switch Applications
PDF  7 Pages
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Manufacturer  TOSHIBA [Toshiba Semiconductor]
Direct Link  http://www.semicon.toshiba.co.jp/eng
Logo TOSHIBA - Toshiba Semiconductor

TPCC8105 Datasheet(HTML) 3 Page - Toshiba Semiconductor

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TPCC8105
2010-09-03
3
Electrical Characteristics (Ta = 25°C)
Characteristic
Symbol
Test Condition
Min
Typ.
Max
Unit
Gate leakage current
IGSS
VGS = ±20 V, VDS = 0 V
⎯
⎯
±100
nA
Drain cutoff current
IDSS
VDS = −30 V, VGS = 0 V
⎯
⎯
−10
μA
V(BR)DSS
ID = −10 mA, VGS = 0 V
−30
⎯
⎯
Drain-source breakdown voltage
V(BR)DSX
ID = −10 mA, VGS = 10 V (Note 4)
−21
⎯
⎯
V
Gate threshold voltage
Vth
VDS = −10 V, ID = −0.5 mA
−0.8
⎯
−2.0
V
VGS = −4 .5V, ID = −11.5 A
⎯
8
10.4
Drain-source on-resistance
RDS(ON)
VGS = −10 V, ID = −11.5 A
⎯
6
7.8
m
Ω
Input capacitance
Ciss
⎯
3240
⎯
Reverse transfer capacitance
Crss
⎯
520
⎯
Output capacitance
Coss
VDS = −10 V, VGS = 0 V, f = 1 MHz
⎯
580
⎯
pF
Rise time
tr
⎯
8
⎯
Turn-on time
ton
⎯
14
⎯
Fall time
tf
⎯
110
⎯
Switching time
Turn-off time
toff
Duty
≤ 1%, tw = 10 μs
⎯
330
⎯
ns
Total gate charge
(gate-source plus gate-drain)
Qg
⎯
76
⎯
Gate-source charge 1
Qgs1
⎯
7.6
⎯
Gate-drain (“Miller”) charge
Qgd
VDD ≈ −24 V, VGS = −10 V,
ID = −23 A
⎯
20
⎯
nC
Source-Drain Ratings and Characteristics (Ta = 25°C)
Characteristic
Symbol
Test Condition
Min
Typ.
Max
Unit
Drain reverse current
Pulse
(Note 1)
IDRP
⎯
⎯
⎯
−69
A
Forward voltage (diode)
VDSF
IDR = −23 A, VGS = 0 V
⎯
⎯
1.2
V
Note 4: VDSX mode (the application of a plus voltage between gate and source) may cause decrease in maximum
rating of drain-source voltage.
VDD ≈ −15 V
−10 V
VGS 0 V
ID = −11.5 A
VOUT



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