108-2072

Rev E

5 of 11

3.6.

Product Qualification and Requalification Test Sequence

A.

Tier 1 Product

Test Group (a)

1

2

3

4

5

Test or Examination

Test Sequence (b)

Initial examination of product

1

1

1

1

1

Low level contact resistance, circuit

3,7,10,15

3,7,9,12

2,5,7,10

2,5,7,9,12,14,16,19

Low level contact resistance, compliant pin (c)

4,16

4,13

3,11

3,10,17

Insulation resistance

5,13

14

Withstanding voltage

6,14

15

Temperature rise vs current

2

Vibration

8

Mechanical shock

9

Durability

6

4

4,18(d)

Mating force

2,12

2,17

13

Unmating force

8,11

5,16

12

Compliant pin insertion

3

Compliant pin retention

18

18

14

20

4

Minute disturbance

15

Thermal shock

10

Humidity-temperature cycling

11

Temperature life

9

Mixed flowing gas

6(e),8(e),11(f),13(f)

Dust contamination

8

6

Final examination of product

17

19

15

21

NOTE

(a)

See paragraph 4.1.A.

(b)

Numbers indicate sequence in which tests are performed.

(c)

Compliant pin design requires special test printed circuit board for low level contact

resistance data collection. Separate, parallel test groups to be supplied where this data

is required.

(d)

Perform 100 cycles of durability before, and 100 cycles after mixed flowing gas testing.

(e)

Exposure interval of 5 days with specimens unmated.

(f)

Exposure interval of 5 days with specimens mated.

Figure 2A