Electronic Components Datasheet Search
  English  ▼

X  

APL3213 Datasheet(PDF) 10 Page - Anpec Electronics Coropration

Part # APL3213
Description  Li Charger Protection IC
PDF  15 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Manufacturer  ANPEC [Anpec Electronics Coropration]
Direct Link  http://www.anpec.com.tw
Logo ANPEC - Anpec Electronics Coropration

APL3213 Datasheet(HTML) 10 Page - Anpec Electronics Coropration

Back Button APL3213 Datasheet HTML 6Page - Anpec Electronics Coropration APL3213 Datasheet HTML 7Page - Anpec Electronics Coropration APL3213 Datasheet HTML 8Page - Anpec Electronics Coropration APL3213 Datasheet HTML 9Page - Anpec Electronics Coropration APL3213 Datasheet HTML 10Page - Anpec Electronics Coropration APL3213 Datasheet HTML 11Page - Anpec Electronics Coropration APL3213 Datasheet HTML 12Page - Anpec Electronics Coropration APL3213 Datasheet HTML 13Page - Anpec Electronics Coropration APL3213 Datasheet HTML 14Page - Anpec Electronics Coropration Next Button
Zoom Inzoom in Zoom Outzoom out
 10 / 15 page
background image
Copyright
© ANPEC Electronics Corp.
Rev. A.3 - Aug., 2011
www.anpec.com.tw
10
APL3213/A
Application Information
Capacitor Selection
The input capacitor is for decoupling and prevents the
input voltage from overshooting to dangerous levels. In
the AC adapter hot plug-in applications or load current
step-down transient, the input voltage has a transient
spike due to the parasitic inductance of the input cable. A
25V, X5R, dielectric ceramic capacitor with a value be-
tween 1
µF and 4.7µF placed close to the ACIN pin is
recommended.
The output capacitor is for output voltage decoupling, and
also the input capacitor of the charging circuit.
At least, a 1
µF, 10V, X5R capacitor is recommended.
In some failure modes, a high voltage may be applied to
the device. Make sure the clearance constraint of the PCB
layout must satisfy the design rule for high voltage.
The exposed pad of the TDFN2x2-8 performs the func-
tion of channeling heat away. It is recommended that
connect the exposed pad to a large copper ground plane
on the backside of the circuit board through several ther-
mal vias to improve heat dissipation.
The input and output capacitors should be placed close
to the IC.
The high current traces like input trace and output trace
must be wide and short.
Layout Consideration



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15


Datasheet Download

Go To PDF Page


Link URL



Does ALLDATASHEET help your business so far?  [ DONATE ] 

About Alldatasheet   |   Advertisement   |   Contact us   |   Privacy Policy   |   Link to Datasheet    |   Link Exchange   |   Manufacturer List
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com