Copyright

© ANPEC Electronics Corp.

Rev. A.3 - Aug., 2011

www.anpec.com.tw

14

APL3213/A

Profile Feature

Sn-Pb Eutectic Assembly

Pb-Free Assembly

Preheat & Soak

100

°C

150

°C

60-120 seconds

150

°C

200

°C

60-120 seconds

Average ramp-up rate

3

°C/second max.

3

°C/second max.

183

°C

60-150 seconds

217

°C

60-150 seconds

Peak package body Temperature

See Classification Temp in table 1

See Classification Temp in table 2

°C of the specified

20** seconds

30** seconds

6

°C/second max.

6

°C/second max.

Time 25

°C to peak temperature

6 minutes max.

8 minutes max.

Classification Reflow Profiles

Table 2. Pb-free Process – Classification Temperatures (Tc)

Package

Thickness

Volume mm

3

<350

Volume mm

3

350-2000

Volume mm

3

>2000

<1.6 mm

260

°C

260

°C

260

°C

1.6 mm – 2.5 mm

260

°C

250

°C

245

°C

≥2.5 mm

250

°C

245

°C

245

°C

Table 1. SnPb Eutectic Process – Classification Temperatures (Tc)

Package

Thickness

Volume mm

3

<350

Volume mm

3

≥350

<2.5 mm

235

°C

220

°C

≥2.5 mm

220

°C

220

°C

Reliability Test Program

Test item

Method

Description

SOLDERABILITY

JESD-22, B102

5 Sec, 245

°C

HOLT

JESD-22, A108

1000 Hrs, Bias @ Tj=125

°C

PCT

JESD-22, A102

168 Hrs, 100

%RH, 2atm, 121°C

TCT

JESD-22, A104

500 Cycles, -65

°C~150°C

HBM

MIL-STD-883-3015.7

VHBM≧2KV

MM

JESD-22, A115

VMM≧200V

Latch-Up

JESD 78