LM337

http://onsemi.com

9

PACKAGE DIMENSIONS

CASE 936−03

ISSUE D

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

8.38

5.080

DIMENSIONS: MILLIMETERS

PITCH

2X

16.155

1.016

2X

10.49

3.504

5 REF

5 REF

V

U

TERMINAL 4

NOTES:

1.

DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2.

CONTROLLING DIMENSION: INCHES.

3.

TAB CONTOUR OPTIONAL WITHIN

DIMENSIONS A AND K.

4.

DIMENSIONS U AND V ESTABLISH A MINIMUM

MOUNTING SURFACE FOR TERMINAL 4.

5.

DIMENSIONS A AND B DO NOT INCLUDE

MOLD FLASH OR GATE PROTRUSIONS. MOLD

FLASH AND GATE PROTRUSIONS NOT TO

EXCEED 0.025 (0.635) MAXIMUM.

6.

SINGLE GAUGE DESIGN WILL BE SHIPPED

AFTER FPCN EXPIRATION IN OCTOBER 2011.

DIM

A

MIN

MAX

MIN

MAX

MILLIMETERS

0.386

0.403

9.804

10.236

INCHES

B

0.356

0.368

9.042

9.347

C

0.170

0.180

4.318

4.572

D

0.026

0.036

0.660

0.914

E

0.045

0.055

1.143

1.397

F

0.051 REF

1.295 REF

G

0.100 BSC

2.540 BSC

H

0.539

0.579

13.691

14.707

J

0.125 MAX

3.175 MAX

K

0.050 REF

1.270 REF

L

0.000

0.010

0.000

0.254

M

0.088

0.102

2.235

2.591

N

0.018

0.026

0.457

0.660

P

0.058

0.078

1.473

1.981

R

S

0.116 REF

2.946 REF

U

0.200 MIN

5.080 MIN

V

0.250 MIN

6.350 MIN

__

A

12

3

K

F

B

J

S

H

D

M

0.010 (0.254)

T

E

OPTIONAL

CHAMFER

BOTTOM VIEW

OPTIONAL CONSTRUCTIONS

TOP VIEW

SIDE VIEW

DUAL GAUGE

BOTTOM VIEW

L

T

P

R

DETAIL C

SEATING

PLANE

2X

G

N

M

CONSTRUCTION

D

C

DETAIL C

E

OPTIONAL

CHAMFER

SIDE VIEW

SINGLE GAUGE

CONSTRUCTION

S

C

DETAIL C

T

T

D

E

0.018

0.026

0.457

0.660

S