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TS30011/12/13

Version 1.6

Specifications subject to change

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Copyright © 2012, Triune Systems, LLC

The exposed thermal pad must be soldered to the PCB for mechanical reliability and to achieve good power dissipation. Vias

must be placed under the pad to transfer the heat to the ground plane.

PGND

VCC

VOUT

Vias to

ground

plane

Vias to

ground

plane

Analog

ground

(GND)

Switching

node

VCC

VCC

GND

VSW

VCC

BST

EN

VSW

Figure 23: TS30011/12/13 PCB Layout, Top View

EXTERNAL COMPONENT BILL OF MATERIALS

Designator

Function

Description

Suggested

Manufacturer

Manufacturer Code

Qty

Input Supply Bypass

Capacitor

10uF 10%

35V

TDK

CGA5L3X5R1V106K160AB

1

Output Filter Capacitor

22uF 10%

10V

TDK

C2012X5R1A226K125AB

2

Output Filter Inductor (1A)

4.7uH 2A

TDK

Wurth

SLF7045T-4R7M2R0-PF

7447745047

1

Output Filter Inductor (2A)

4.7uH 3A

TDK

Wurth

VLC5045T-4R7M

744774047

1

Output Filter Inductor (3A)

4.7uH 4.37A

TDK

Wurth

VLP6045LT-4R7M

744777004

1

Boost Capacitor

22nF 10V

TDK

C1005X7R1C223K

1