| Electronic Components Datasheet Search |
|
MP8709 Datasheet(PDF) 2 Page - Monolithic Power Systems |
|
|
|||||||||||||||||||||||||||||
MP8709 Datasheet(HTML) 2 Page - Monolithic Power Systems |
|
2 / 14 page ![]() MP8709 – SYNCHRONOUS STEP-DOWN CONVERTER WITH INTERNAL MOSFETS MP8709 Rev. 1.01 www.MonolithicPower.com 2 12/14/2011 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited. © 2011 MPS. All Rights Reserved. ORDERING INFORMATION Part Number* Package Top Marking Free Air Temperature (TA) MP8709EN SOIC8E MP8709EN -20 °C to +85°C * For Tape & Reel, add suffix –Z (e.g. MP8709EN–Z); For RoHS compliant packaging, add suffix –LF (e.g. MP8709EN–LF–Z) PACKAGE REFERENCE IN SW SW BST GND VCC FB EN/SYNC 1 2 3 4 8 7 6 5 TOP VIEW EXPOSED PAD ON BACKSIDE CONNECT TO GND ABSOLUTE MAXIMUM RATINGS (1) Supply Voltage VIN ....................................... 22V VSW........................-0.3V (-5V for < 10ns) to 23V VBS ....................................................... VSW + 6V All Other Pins..................................-0.3V to +6V Operating Temperature.............. -20 °C to +85°C Continuous Power Dissipation (TA = +25°C) (2) ……………………………………………....2.5W Junction Temperature...............................150 °C Lead Temperature ....................................260 °C Storage Temperature............... -65 °C to +150°C Recommended Operating Conditions (3) Supply Voltage VIN ...........................4.5V to 21V Operating Junct. Temp (TJ)...... -20°C to +125°C Thermal Resistance (4) θJA θJC SOIC8E (Exposed Pad) ..........50 ...... 10 ... °C/W Notes: 1) Exceeding these ratings may damage the device. 2) The maximum allowable power dissipation is a function of the maximum junction temperature TJ(MAX), the junction-to- ambient thermal resistance θJA, and the ambient temperature TA. The maximum allowable continuous power dissipation at any ambient temperature is calculated by PD(MAX)=(TJ(MAX)- TA)/θJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. 3) The device is not guaranteed to function outside of its operating conditions. 4) Measured on JESD51-7, 4-layer PCB. |
|
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |