MP18021 datasheet(2/9 Pages) MPS

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MP18021―100V HIGH FREQUENCY HALF-BRIDGE GATE DRIVER

MP18021 Rev. 1.0

www.MonolithicPower.com

8/8/2012

MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited.

ORDERING INFORMATION

Part Number*

Package

Top Marking

Free Air Temperature (TA)

MP18021HN

SOIC8EP

MP18021HN

–40

C to + 125C

* For Tape & Reel, add suffix –Z (e.g. MP18021HN–Z);

For RoHS compliant packaging, add suffix –LF; (e.g. MP18021HN–LF–Z)

PACKAGE REFERENCE

VDD

BST

DRVH

DRVL

VSS

INL

INH

TOP VIEW

ABSOLUTE MAXIMUM RATINGS (1)

Supply Voltage (VDD)....................–0.3V to +18V

SW Voltage (VSW) ........................–5.0V to 100V

BST Voltage (VBST) .......................-0.3V to 100V

BST to SW ...................................–0.3V to +18V

DRVH to SW................................–0.3V to +18V

All Other Pins......................–0.3V to (VDD+0.3V)

Continuous Power Dissipation

(TA =+25°C)

(2)

............................................................. 2.6W

Junction Temperature...............................150

C

Lead Temperature ....................................260

C

Storage Temperature.............. –65°C to +150

C

Recommended Operating Conditions

(3)

Supply Voltage VDD .....................+9.0V to 16.0V

SW Voltage (VSW) ..................-1.0V to 100V-VDD

SW slew rate......................................<50V/nsec

Operating Junct. Temp (TJ)..... –40C to +140C

Thermal Resistance

(4)

θJA

θJC

SOIC8 (Exposed Pad) ............ 48 ...... 10...

C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ(MAX), the junction-to-

ambient thermal resistance θJA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD(MAX)=(TJ(MAX)-

TA)/ θJA. Exceeding the maximum allowable power dissipation

will cause excessive die temperature, and the regulator will go

into thermal shutdown. Internal thermal shutdown circuitry

protects the device from permanent damage.

3) The device is not guaranteed to function outside of its

operating conditions.

4) Measured on JESD51-7, 4-layer PCB.

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