MP28119 datasheet(2/12 Pages) MPS

2 / 12 page

MP28119 – ULTRA-SMALL 1.7MHZ, 600MA LOW-VOLTAGE SYNCHRONOUS STEP-DOWN CONVERTER

MP28119 Rev.0.91

www.MonolithicPower.com

11/23/2011

MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.

ORDERING INFORMATION

Part Number

VOUT

Package

Temperature

Top Marking

MP28119EG-1.0

1.0V

MP28119EG-1.2*

1.2V

MP28119EG*

ADJ

2x2 QFN8

-20°C to +85°C

* Contact factory for availability.

MP28119EG-1.0 is fixed to 1V output, and MP28119EG-1.2 is fixed to 1.2V output. For RoHS Compliant Packaging, add suffix - LF (e.g.

MP28119EG-LF); For Tape and Reel, add suffix -Z (e.g. MP28119EG-LF-Z).

PACKAGE REFERENCE

TOP VIEW

GND

EXPOSED PAD

ON BACKSIDE

CONNECT TO GND

TOP VIEW

GND

OUT

EXPOSED PAD

ON BACKSIDE

CONNECT TO GND

External FB

QFN8

(2mm x 2mm)

Fixed Output

QFN8

(2mm x 2mm)

ABSOLUTE MAXIMUM RATINGS

(1)

VIN to GND ..................................–0.3V to +6.5V

VSW to GND........................... –0.3V to VIN +0.3V

VFB, VEN to GND ..........................–0.3V to +6.5V

Junction Temperature.............................+150

C

Continuous Power Dissipation (TA = +25°C)

(2)

............................................................. 1.5W

Lead Temperature ..................................+260

C

Storage Temperature ............. –65

C to +150C

Recommended Operating Conditions

(3)

Supply Voltage VIN .............................2.5V to 6V

Output Voltage VOUT...........................0.6V to 6V

Operating Temperature............. –20

C to +85C

Thermal Resistance

(4)

θJA

θJC

2x2 QFN8................................80 ...... 16 ...

C/W

Notes:

1) Exceeding these ratings may damage the device.

2) The maximum allowable power dissipation is a function of the

maximum junction temperature. TJ(MAX) the junction-to-

ambient thermal resistance θJA and the ambient temperature

TA. The maximum allowable power dissipation at any ambient

temperature is calculated using: PD(MAX)=(TJ(MAX)-TA)/ θJA.

Exceeding the maximum allowable power dissipation will

cause excessive die temperature, and the regulator will go

into thermal shutdown. Internal thermal shutdown circuitry

protects the device from permanent damage.

3) The device is not guaranteed to function outside of its

operating conditions.

4) Measured on JESD51-7 4-layer board.

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