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MP62161DS Datasheet(PDF) 2 Page - Monolithic Power Systems |
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MP62161DS Datasheet(HTML) 2 Page - Monolithic Power Systems |
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2 / 12 page  MP62160/MP62161 –CURRENT-LIMITED POWER DISTRIBUTION SWITCH MP62160_MP62161 Rev. 0.9 www.MonolithicPower.com 2 7/8/2010 MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited. © 2010 MPS. All Rights Reserved. ORDERING INFORMATION Part Number Enable Switch Maximum Continuous Load Current Typical Short- Circuit Current @ TA=25C Package Top Marking Free Air Temperature (TA) MP62160DS SOIC8 62160DS MP62160DD QFN8E (2mm x 3mm) 62160DD MP62160DH* Active Low MSOP8E 62160DH MP62161DS SOIC8 62161DS MP62161DD QFN8E (2mm x 3mm) 62161DD MP62161DH Active High Single 2A 2.8A MSOP8E 62161DH -40 °C to +85°C * For Tape & Reel, add suffix –Z (e.g. MP62160DH–Z). For RoHS Compliant Packaging, add suffix –LF (e.g. MP62160DH–L) PACKAGE REFERENCE 1 2 3 4 8 7 6 5 TOP VIEW GND IN IN EN* OUT OUT OUT FLAG EXPOSED PAD ON BACKSIDE CONNECT TO GND TOP VIEW GND IN IN EN* 1 2 3 4 OUT OUT OUT FLAG 8 7 6 5 EXPOSED PAD ON BACKSIDE CONNECT TO GND GND IN IN EN* OUT OUT OUT FLAG 1 2 3 4 8 7 6 5 TOP VIEW MSOP8E QFN8E (2mm x 3mm) SOIC8 MP62160/MP62161 Single-Channel (*: EN is active high for MP62161) ABSOLUTE MAXIMUM RATINGS (1) IN .................................................-0.3V to +6.0V EN, FLAG, OUT to GND ..............-0.3V to +6.0V Continuous Power Dissipation (TA = +25°C) (2) MSOP8E.................................................... 2.3W QFN8E (2mm x 3mm)................................ 2.3W SOIC8 ........................................................ 1.4W Junction Temperature...............................150°C Lead Temperature ....................................260°C Storage Temperature............... -65°C to +150°C Operating Temperature.............. -40°C to +85°C Thermal Resistance (3) θJA θJC MSOP8E................................. 55 ...... 12... °C/W QFN8E (2mm x 3mm) ............ 55 ...... 12... °C/W SOIC8..................................... 90 ...... 42... °C/W Notes: 1) Exceeding these ratings may damage the device. 2) The maximum allowable power dissipation is a function of the maximum junction temperature TJ(MAX), the junction-to- ambient thermal resistance θJA, and the ambient temperature TA. The maximum allowable continuous power dissipation at any ambient temperature is calculated by PD(MAX)=(TJ(MAX)- TA)/θJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. 3) Measured on JESD51-7, 4-layer PCB. |
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