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MPQ4459 Datasheet(PDF) 2 Page - Monolithic Power Systems |
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MPQ4459 Datasheet(HTML) 2 Page - Monolithic Power Systems |
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2 / 17 page ![]() MPQ4459 – INDUSTRIAL GRADE, 1.5A, 4MHz, 36V STEP-DOWN CONVERTER MPQ4459 Rev. 1.0 www.MonolithicPower.com 2 12/5/2012 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited. © 2012 MPS. All Rights Reserved. ORDERING INFORMATION Part Number* Package Top Marking MPQ4459DQT TQFN10(3mm x 3mm) N4 * For Tape & Reel, add suffix –Z (eg. MPQ4459DQT–Z) For RoHS compliant packaging, add suffix –LF(eg. MPQ4459DQT–LF–Z) PACKAGE REFERENCE ABSOLUTE MAXIMUM RATINGS (1) Supply Voltage (VIN).....................–0.3V to +40V Switch Voltage (VSW)............ –0.3V to VIN + 0.3V BST to SW .....................................–0.3V to +6V All Other Pins.................................–0.3V to +6V Continuous Power Dissipation (TA = +25°C) (2) ……………………………………………….2.5W Junction Temperature...............................150 °C Lead Temperature ....................................260 °C Storage Temperature.............. –65°C to +150 °C Recommended Operating Conditions (3) Supply Voltage VIN ...........................3.8V to 36V Output Voltage VOUT.........................0.8V to 30V Operating Junct. Temp (TJ)..... –40°C to +125°C Thermal Resistance (4) θJA θJC 3x3 TQFN10 ...........................50 ...... 12 ... °C/W Notes: 1) Exceeding these ratings may damage the device 2) The maximum allowable power dissipation is a function of the maximum junction temperature TJ(MAX), the junction-to- ambient thermal resistance θJA, and the ambient temperature TA. The maximum allowable continuous power dissipation at any ambient temperature is calculated by PD(MAX)=(TJ(MAX)-TA)/ θJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. 3) The device is not guaranteed to function outside of its operating conditions. 4) Measured on JESD51-7, 4-layer PCB. TOP VIEW SW SW EN COMP FB 1 2 3 4 5 BST VIN VIN FREQ GND 10 9 8 7 6 EXPOSED PAD ON BACKSIDE |
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