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W25Q80BWSVIP Datasheet(PDF) 72 Page - Winbond |
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W25Q80BWSVIP Datasheet(HTML) 72 Page - Winbond |
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72 / 74 page  W25Q80BW - 72 - 10. ORDERING INFORMATION Notes: 1. The “W” prefix is not included on the part marking. 2. Only the 2 nd letter is used for the part marking. WSON package type ZP is not used for the part marking. 3. Standard bulk shipments are in Tube (shape E). Please specify alternate packing method, such as Tape and Reel (shape T) or Tray (shape S), when placing orders. 4. For shipments with OTP feature enabled, please specify when placing orders. W (1) 25Q 80B W xx(2) W = Winbond 25Q = SpiFlash Serial Flash Memory with 4KB sectors, Dual/Quad I/O 80B = 8M-bit W = 1.65V to 1.95V SN = 8-pin SOIC 150-mil SV = 8-pin VSOP 150-mil SS = 8-pin SOIC 208-mil ST = 8-pin VSOP 208-mil ZP = 8-pad WSON 6x5-mm BY = 8-ball WLBGA I = Industrial (-40°C to +85°C) G = Green Package (Lead-free, RoHS Compliant, Halogen-free (TBBA), Antimony-Oxide-free Sb2O3) P = Green Package with Status Register Power-Down & OTP enabled L = Special driver strength version for certain applications C = WLBGA package with backside coating (3,4) |
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