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APE0504 Datasheet(PDF) 6 Page - Aplus Intergrated Circuits |
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APE0504 Datasheet(HTML) 6 Page - Aplus Intergrated Circuits |
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6 / 6 page ![]() APExx04 Series Rev 1.3 2003/8/18 5 6.0 Bonding Diagram Pad # Pad Name X Y Pad # Pad Name X Y 1 PWM2 57 253 7 PRA0 785 87 2 Vdd1 58 58 8 PRA1 895 87 3 PWM1 253 57 9 PRA2 1005 87 4 GND1 404 58 10 GND2 995 231 5 Vdd2 565 87 11 PRA3 995 341 6 OSC 675 87 Chip Size : APE0504 : 1166 um x 1094 um APE1004 : 1166 um x 1206 um ROM PRA3 2 3 4 5 6 7 8 9 10 11 GND2 PRA2 PRA1 PRA0 OSC Vdd2 GND1 PWM1 PWM2/Cout Vdd1 1 (0, 0) Pad Size: 80 um x 80 um * The IC substrate must be connected to GND. X Y |
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