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APR9301-V2 Datasheet(PDF) 6 Page - Aplus Intergrated Circuits

Part # APR9301-V2
Description  SINGLE-CHIP VOICE RECORDING & PLAYBACK DEVICE FOR SINGLE 20 TO 30 SECOND MESSAGE
PDF  7 Pages
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Manufacturer  APLUS [Aplus Intergrated Circuits]
Direct Link  http://www.aplusinc.com.tw
Logo APLUS - Aplus Intergrated Circuits

APR9301-V2 Datasheet(HTML) 6 Page - Aplus Intergrated Circuits

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Page 6
Bonding Pad Diagram & Description of Bonding Pad Coordinates
Figure 5 APR9301-V2 Die Bonding Pad Diagram
Table 5 APR9301-V2 Bonding Pad Coordinates
Pin
Pin Name
X Axis(Note)
Y Axis(Note)
/CE
Chip Enable
-2496.20
1565.80
OscR
Oscillator Frequency-Setting Resistor
-2459.55
729.80
NU1
Connect to Ground
-1808.45
-1496.10
VSSD
Digital Ground Supply
-1564.05
-1572.00
VSSA
Analog Ground Supply
-1384.05
-1548.70
VSSA
Analog Ground Supply
-1204.35
-1477.10
SP+
Non-Inverting Speaker Output
-707.15
-1390.00
SP-
Inverting Speaker Output
479.15
-1389.90
VCCA
Analog Power Supply
976.45
-1492.00
VCCA
Analog Power Supply
1190.40
-1523.70
MicIn
Microphone Input
1619.45
-1551.40
MicRef
Microphone Reference Input
2035.45
-1551.40
AGC
Automatic Gain Control
2487.45
-1551.40
AnaIn
Analog Signal Input
2487.45
-1049.90
AnaOut
Analog Signal Output
2487.45
-648.90
/PlayEEdge-Activated Playback
2493.65
1371.10
/LED
LED Output
1430.70
1565.80
NU2
Connect to Ground
865.75
1565.80
/RecL
Level-Activated Record
258.15
1565.80
VCCD
Digital Power Supply
-229.40
1579.05
VCCD
Digital Power Supply
-510.80
1541.60
Note: With respect to die center (µm)
O scR
/L
ED
N
U
2
/R
ecL
V
C
C
D
V
CC
D
/C
E
/P
lay
E
AnaO ut
AnaIn
NU
1
V S
SD
A
G
C
M
ic
R
ef
V
C
C
A
SP
-
SP
+
V S
SA
V S
SA
Notes:
Die diagram is with respect to die
center (µm).
Die Dimensions:
x = 214 + 1 mils
y = 144 + 1 mils
Die Thickness:
13.8 + 1.0 mils
(350 + 25 µm
Pad Opening:
110 µ m
4.3 mils
Connect substrate to ground.
M
ic
In
APR9301-V2
V
C
C
A
APLUS
APR9301-V2
APLUS
APR9301-V2



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