A T C H I G H P O W E R R E S I S T I V E P R O D U C T S

350

300

250

200

150

100

50

0

0

25

50

75

100

125

150

Attenuator Power Handling vs. Mounting Surface Temperature

Notes:

1. Plot refers to incident continuous power of “P” Watts

2. Mounting surface is assumed an isotherm at T

3. Actual testing done at P = 100 Watts, T

4. Plot based on 1-dimensional heat transfer formula: T = T

T = area-average resistive film temperature, held to 150 °C, max.

R = thermal resistance, mounting surface to resistive film ≈ 0.5 °C/W

for 30- and 20- dB devices (other values will run cooler and therefore

handle more power – consult factory)

Mounting Surface Temperature (°C)

* Test Condition: With mounting surface temperature = 75 °C, max. (see plot above). Actual test conditions are as follows:

Flange attached to a large copper carrier whose surface, directly under the flange center, is held at 100 °C; power

applied = 100 Watts. Specification: The attenuation shall change no more that 0.2 dB during and after a 100-hr.

Burn-in per MIL-PRF-55342.

** Attenuation vs. frequency as a function of temperature, -55°C to +125°C

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T E C H N I C A L

C E R A M I C S

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Sales of ATC products are subject to the terms and conditions contained in American Technical Ceramics Corp. Terms and Conditions of Sale (ATC document #001-992 Rev. B 12/05).

Copies of these terms and conditions will be provided upon request. They may also be viewed on ATC's website at www.atceramics.com/productfinder/default.asp. Click on the link

for Terms and Conditions of Sale.

ATC has made every effort to have this information as accurate as possible. However, no responsibility is assumed by ATC for its use, nor for any infringements of rights of third

parties which may result from its use. ATC reserves the right to revise the content or modify its product without prior notice.

© 2012 American Technical Ceramics Corp. All Rights Reserved.

Excerpt from ATC # 001-944; Rev. R, 11/13