© 2005 Microchip Technology Inc.

DS21921B-page 15

MCP1612

8-Lead Plastic Dual-Flat, No-Lead Package (MF) 3x3x0.9 mm Body (DFN) – Saw Singulated

D2

E

A1

A

A3

TOP VIEW

EXPOSED

METAL

PAD

BOTTOM VIEW

2

1

ID INDEX

PIN 1

D

L

E2

p

b

n

AREA

(NOTE 1)

TIE BAR

(NOTE 3)

EXPOSED

ALTERNATE EXPOSED

PAD CONFIGURATIONS

(NOTE 2)

Exposed pad varies according to die attach paddle size.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

NOM

INCHES

.026 BSC

.118 BSC

.008 REF.

.118 BSC

Package may have one or more exposed tie bars at ends.

Pin 1 visual index feature may vary, but must be located within the hatched area.

JEDEC equivalent: M0-229

See ASME Y14.5M

See ASME Y14.5M

* Controlling Parameter

Revised 07-20-05

Exposed Pad Width

Number of Pins

Contact Thickness

Overall Length

Overall Height

Exposed Pad Length

Contact Length

Contact Width

Overall Width

Notes:

Standoff

Pitch

Units

Dimension Limits

D2

L

b

E2

D

A1

A3

E

A

p

.043

.059

.008

.009

.000

.031

MIN

n

MILLIMETERS*

.061

.092

.016

.012

.001

.035

.063

.096

.020

.015

.002

.039

8

MAX

3.00 BSC

0.20 REF.

0.65 BSC

3.00 BSC

1.09

0.20

0.23

1.50

0.80

0.00

1.55

0.40

0.30

2.37

0.02

0.90

MIN

NOM

8

2.45

0.50

0.37

1.60

0.05

1.00

MAX

1.

2.

3.

Drawing No. C04-062