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TMD37827 Datasheet(PDF) 31 Page - ams AG |
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TMD37827 Datasheet(HTML) 31 Page - ams AG |
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31 / 34 page ![]() Datasheet - Mar. 2013 - V2 TMD3782 – 31 Soldering Information The package has been tested and has demonstrated an ability to be reflow soldered to a PCB substrate. The solder reflow profile describes the expected maximum heat exposure of components during the solder reflow process of product on a PCB. Temperature is measured on top of component. The components should be limited to a maximum of three passes through this solder reflow profile. Figure TMD3782 – 45: Solder Reflow Profile Figure TMD3782 – 46: Solder Reflow Profile Graph Parameter Reference Device Average temperature gradient in preheating 2.5 ºC/sec Soak time tsoak 2 to 3 minutes Time above 217 ºC (T1) t1 Max 60 sec Time above 230 ºC (T2) t2 Max 50 sec Time above Tpeak - 10 ºC (T3) t3 Max 10 sec Peak temperature in reflow Tpeak 260 ºC Temperature gradient in cooling Max -5 ºC/sec Soldering and Storage Information |
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