TSL2568, TSL2569

LIGHT-TO-DIGITAL CONVERTER

TAOS091D − DECEMBER 2008

29

The LUMENOLOGY

r Company

r

r

Copyright

E 2008, TAOS Inc.

www.taosinc.com

MECHANICAL DATA

PACKAGE TMB-6

Six-Lead Surface Mount Device

PIN 1

0.31

1.90

2.60

3.80

1.35

0.90 TYP

0.90

TYP

0.30

TYP

0.60

TYP

0.30

TYP

TOP VIEW

BOTTOM VIEW

END VIEW

R 0.20

6 Pls

PIN 4

Lead Free

Pb

Photo-Active Area

TOP VIEW

0.50

0.88

0.0745 Typ

1.30

0.694

Typ

C

L

C

L

NOTES: A. All linear dimensions are in millimeters. Dimension tolerance is

± 0.20 mm unless otherwise noted.

B. The photo-active area is 1388

μm by 149 μm.

C. Package top surface is molded with an electrically nonconductive clear plastic compound having an index of refraction of 1.55.

D. Contact finish is 0.5

μm minimum of soft gold plated over a 18 μm thick copper foil pattern with a 5 μm to 9 μm nickel barrier.

E. The underside of the package includes copper traces used to connect the pads during package substrate fabrication. Accordingly,

exposed traces and vias should not be placed under the footprint of the TMB package in a PCB layout.

F. This package contains no lead (Pb).

G. This drawing is subject to change without notice.

Figure 20. Package T — Six-Lead TMB Plastic Surface Mount Packaging Configuration