ISZ-650 Single-Axis Z-Gyroscope

Product Specification

PS-ISZ-0650B-00-02

Release Date: 07/08/09

CONFIDENTIAL & PROPRIETARY

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9.13

Reflow Specification

The approved solder reflow curve shown in the figure below conforms to IPC/JEDEC J-STD-020D.01

(Moisture/Reflow Sensitivity Classification for Non hermetic Solid State Surface Mount Devices) with a

maximum peak temperature (Tc = 260°C). This is specified for component-supplier reliability qualification

testing using lead-free solder for package thicknesses less than 1.6 mm. The reliability qualification pre-

conditioning used by InvenSense incorporates three of these conforming reflow cycles. All temperatures

refer to the topside of the QFN package, as measured on the package body surface. Customer solder-reflow

processes should use the solder manufacturer’s recommendations, making sure to never exceed the

constraints listed in the table and figure below, as these represent the maximum tolerable ratings for the

device. For optimum results, production solder reflow processes should use lower temperatures, reduced

exposure times to high temperatures, and lower ramp-up and ramp-down rates than those listed below.

Approved IR/Convection Solder Reflow Curve

Temperature Set Points for IR / Convection Reflow Corresponding to Figure Above

Step Setting

CONSTRAINTS

Temp (°C)

Time (sec)

Rate (°C/sec)

A

25

B

150

C

200

D

217

E

[≤TPmax-5˚C,255°C]

255

F

G

255

H

217

I

25