21

T5557

4517E–RFID–02/03

Notes:

1. Unique customer ID code programming according to Figure 5 is linked to a minimum order quantity of 1 Mio parts per year.

2. For available order codes refer to Atmel Sales/Marketing.

Ordering Examples

(Recommended)

T555711-DDW

Tested dice on unsawn 6” wafer, thickness 300

capacitor, no damping during POR initialisation;

especially for ISO 11784/785 and access control applications

Available Order Codes

T555711-DDW, DDT, TAS, PP

T555714-DDW, DBW, TAS

T555715-PAE

11

- 2 Pads without on-chip C

see Figure 26

14

- 4 Pads with on-chip 75 pF

see Figure 27

15

- Micro - Module with 330 pF

see Figure 29

01

- 2 Pads without C; Damping during initialisation

see Figure 26

- Atmel standard (corresponds to “00")

M01

- Customer ’X’ unique ID code

(1)

- DDW

- Dice on wafer, 6" un-sawn wafer, thickness 300 µm

- DDT

- Dice in Tray (waffle pack), thickness 300 µm

- DBW

- Dice on solder bumped wafer, thickness 390 µm

see Figure 27

Sn63Pb37 on 5 µm Ni/Au, height 70 µm

see Figure 28

- TAS

- SO8 Package

see Figure 31

- PAE

- MOA2 Micro-Module

see Figure 29

- PP

- Plastic Transponder

see Figure 33

x x x

T 5 5 5 7 a

b M c c -

Package

Drawing