A B C D

1

2

3

Top View

D C B A

1

2

3

Bottom View

LM3697

SNOSCS2A – NOVEMBER 2013 – REVISED DECEMBER 2013

www.ti.com

Application Circuit Component List

Current/Voltage Rating

Component

Manufacturer

Value

Part Number

Size (mm)

(Resistance)

L

TDK

10 µH

VLF302512MT-100M

2.5 mm x 3.0 mm x 1.2

620 mA/0.25

Ω

mm

COUT

TDK

1 µF

C2012X5R1H105

0805

50V

CIN

TDK

2.2 µF

C1005X5R1A225

0402

10V

Diode

On-Semi

Schottky

NSR0240V2T1G

SOD-523

40V, 250 mA

Connection Diagram

Figure 1. 12-Bump DSBGA Package YFQ0012CAA

Pin Descriptions/Functions

Pin

Name

Description

PWM Brightness Control Input for CABC operation. PWM is a high-impedance input and

A1

PWM

cannot be left floating, if not used connect to GND.

A2

SDA

Hardware enable input. Drive this pin high to enable the device. Drive this pin low to force

A3

HWEN

the device into a low power shutdown. HWEN is a high-impedance input and cannot be left

floating.

Input Terminal to high-voltage Current Sink #1 (40V max). The boost converter regulates

B1

HVLED1

B2

SCL

B3

IN

Input Voltage Connection. Bypass IN to GND with a minimum 2.2 µF ceramic capacitor.

Input Terminal to high-voltage Current Sink #2 (40V max). The boost converter regulates

C1

HVLED2

C2

GND

Ground

C3

GND

Ground

Input Terminal to high-voltage Current Sink #3 (40V max). The boost converter regulates

D1

HVLED3

Over-Voltage Sense Input. Connect OVP to the positive terminal of the inductive boost's

D2

OVP

output capacitor (COUT).

Drain Connection for the internal NFET. Connect SW to the junction of the inductor and the

D3

SW

Schottky diode anode.

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

2

Submit Documentation Feedback

Copyright © 2013, Texas Instruments Incorporated

Product Folder Links: LM3697