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WLP200 Datasheet(PDF) 1 Page - California Micro Devices Corp |
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WLP200 Datasheet(HTML) 1 Page - California Micro Devices Corp |
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1 / 6 page  © 2000 California Micro Devices Corp. All rights reserved. 11/10/2000 1 WLP200 CALIFORNIA MICRO DEVICES 215 Topaz Street, Milpitas, California 95035 Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com Wafer Level Package Evaluation RC Filter Network Features • 6 Filters per device • Ultra small footprint, 0.5mm pitch • Silicon substrate • 0.30mm Eutectic Solder Bumps Product Description The WLP200 consists of 6 RC filters with different filter characteristics in a wafer level package (WLP). All I/O pins are ESD protected for contact discharges up to 8KV per the IEC1000-4-2 level 4 specification. Two versions with different capacitor values are available. Cellular phone application frequently demands filtering of signals in the 800 to 2,700 MHz band. California Micro Devices’ unique thin film Flip Chip filters provide a minimum of –30 dB of attenuation over this frequency Applications • EMI filter for Mobile Equipment (e.g. Cellular Phones) • Evaluation Device C1460800 SCHEMATIC DIAGRAM band. The bump size and pitch of these filters are selected such that the device can be placed directly on a FR4 printed circuit board using conventional assembly techniques. Ground-bounce and cross-talk are mini- mized by a die design that provides eight solder bump contacts to the common supply connection. The solder bump contacts are a 63/37 Sn/Pb alloy and are nomi- nally 0.30 mm in diameter. R 50 Ω C GND R 50 Ω R 90 Ω C GND R 90 Ω R 70 Ω C GND R 70 Ω R 50 Ω C GND R 90 Ω C GND R 70 Ω C GND GND C1 D1 D2 D3 D4 D5 B1 A1 A2 A3 A4 A5 C3 B3 C2 B2 C5 B5 C4 B4 GND GND GND GND GND GND |
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Similar Description - WLP200 |
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