MLX81200

BLDC Motor Controller

MLX81200 Product Abstract

Page 13 of 15

June/2012

Rev 2.4

5.

Standard

information

regarding

manufacturability

of

Melexis

products with different soldering processes

Our products are classified and qualified regarding soldering technology, solderability and

moisture sensitivity level according to following test methods:

Reflow Soldering SMD’s (Surface Mount Devices)

•

IPC/JEDEC J-STD-020

Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount

Devices

(classification reflow profiles according to table 5-2)

•

EIA/JEDEC JESD22-A113

Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing

(reflow profiles according to table 2)

Wave Soldering SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)

•

EN60749-20

Resistance of plastic- encapsulated SMD’s to combined effect of moisture and

soldering heat

•

EIA/JEDEC JESD22-B106 and EN60749-15

Resistance to soldering temperature for through-hole mounted devices

Iron Soldering THD’s (Through Hole Devices)

•

EN60749-15

Resistance to soldering temperature for through-hole mounted devices

Solderability SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)

•

EIA/JEDEC JESD22-B102 and EN60749-21

Solderability

For all soldering technologies deviating from above mentioned standard conditions

(regarding peak temperature, temperature gradient, temperature profile etc) additional

classification and qualification tests have to be agreed upon with Melexis.

The application of Wave Soldering for SMD’s is allowed only after consulting Melexis

regarding assurance of adhesive strength between device and board.

Melexis is contributing to global environmental conservation by promoting lead free

solutions. For more information on qualifications of RoHS compliant products (RoHS =

European directive on the Restriction Of the use of certain Hazardous Substances) please