LM6172AMJFQML datasheet(3/25 Pages) NSC

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LM6172QML

www.ti.com

SNOSAR4A – DECEMBER 2010 – REVISED OCTOBER 2011

ABSOLUTE MAXIMUM RATINGS

(1)

Supply Voltage (V+

− V−)

36V

Differential Input Voltage (2)

±10V

Maximum Junction Temperature

150°C

Power Dissipation (3), (4)

1.03W

Output Short Circuit to Ground (5)

Continuous

Storage Temperature Range

−65°C ≤ TA ≤ +150°C

Common Mode Voltage Range

V+ +0.3V to V−

−0.3V

Input Current

±10mA

Thermal Resistance (6)

θJA

8LD CDIP (Still Air)

100°C/W

8LD CDIP (500LF/Min Air Flow)

46°C/W

16LD CLGA (Still Air) “WG”

124°C/W

16LD CLGA (500LF/Min Air Flow) “WG”

74°C/W

16LD CLGA (Still Air) “GW”

135°C/W

16LD CLGA (500LF/Min Air Flow) “GW”

85°C/W

θJC

8LD CDIP (4)

2°C/W

16LD CLGA “WG”(4)

6°C/W

16LD CLGA “GW”

7°C/W

Package Weight

8LD CDIP

980mg

16LD CLGA “WG”

365mg

16LD CLGA “GW”

410mg

ESD Tolerance (7)

4KV

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the

Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may

degrade when the device is not operated under the listed test conditions.

(2)

Differential Input Voltage is measured at VS = ±15V.

(3)

The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax (maximum junction temperature),

θJA (package junction to ambient thermal resistance), and TA (ambient temperature). The maximum allowable power dissipation at any

temperature is PDmax = (TJmax - TA)/θJA or the number given in the Absolute Maximum Ratings, whichever is lower.

(4)

The package material for these devices allows much improved heat transfer over our standard ceramic packages. In order to take full

advantage of this improved heat transfer, heat sinking must be provided between the package base (directly beneath the die), and either

metal traces on, or thermal vias through, the printed circuit board. Without this additional heat sinking, device power dissipation must be

calculated using

θJA, rather than θJC, thermal resistance. It must not be assumed that the device leads will provide substantial heat

transfer out the package, since the thermal resistance of the leadframe material is very poor, relative to the material of the package

base. The stated

θJC thermal resistance is for the package material only, and does not account for the additional thermal resistance

between the package base and the printed circuit board. The user must determine the value of the additional thermal resistance and

must combine this with the stated value for the package, to calculate the total allowed power dissipation for the device.

(5)

Continuous short circuit operation can result in exceeding the maximum allowed junction temperature of 150°C

(6)

All numbers apply for packages soldered directly into a PC board.

(7)

Human body model, 1.5 k

Ω in series with 100 pF.

RECOMMENDED OPERATING CONDITIONS

(1)

Supply Voltage

5.5V

≤ VS ≤ 36V

Operating Temperature Range

−55°C ≤ TA ≤ +125°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the

Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may

degrade when the device is not operated under the listed test conditions.

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