CS8190 datasheet(8/8 Pages) CHERRY

8 / 8 page

Part Number

Description

CS8190ENF16

16L PDIP (internally fused leads)

CS8190EDWF20

20L SOIC (internally fused leads)

CS8190EDWFR20 20L SOIC (internally fused leads)

(tape & reel)

Rev. 11/21/96

Lead Count

Metric

English

Max

Min

Max

Min

16L PDIP*

19.69 18.67

.775

.735

20L SOIC*

13.00 12.60

.512

.496

Ordering Information

Thermal Data

16L PDIP*

20L SOIC*

RQJC

typ

ûC/W

RQJA

typ

ûC/W

Package Specification

PACKAGE DIMENSIONS IN mm (INCHES)

PACKAGE THERMAL DATA

Cherry Semiconductor Corporation reserves the

right to make changes to the specifications without

notice. Please contact Cherry Semiconductor

Corporation for the latest available information.

Plastic DIP (N); 300 mil wide

0.39 (.015)

MIN.

2.54 (.100) BSC

1.77 (.070)

1.14 (.045)

Some 8 and 16 lead

packages may have

1/2 lead at the end

of the package.

All specs are the same.

.203 (.008)

.356 (.014)

REF: JEDEC MS-001

3.68 (.145)

2.92 (.115)

8.26 (.325)

7.62 (.300)

7.11 (.280)

6.10 (.240)

.356 (.014)

.558 (.022)

Surface Mount Wide Body (DW); 300 mil wide

1.27 (.050) BSC

7.60 (.299)

7.40 (.291)

10.65 (.419)

10.00 (.394)

0.32 (.013)

0.23 (.009)

1.27 (.050)

0.40 (.016)

REF: JEDEC MS-013

2.49 (.098)

2.24 (.088)

0.51 (.020)

0.33 (.013)

2.65 (.104)

2.35 (.093)

0.30 (.012)

0.10 (.004)

*Internally Fused Leads

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