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ZIOL2102 Datasheet(PDF) 66 Page - List of Unclassifed Manufacturers

Part # ZIOL2102
Description  IO-Link compliant HV Line Driver IC Family
PDF  91 Pages
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Manufacturer  ETC2 [List of Unclassifed Manufacturers]
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ZIOL2102 Datasheet(HTML) 66 Page - List of Unclassifed Manufacturers

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ZIOL2xxx – IC Family
IO-Link compliant HV Line Driver IC Family
Data Sheet
January 31, 2012
© 2012 Zentrum Mikroelektronik Dresden AG — Rev. 2.2.1
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without
the prior written consent of the copyright owner. The information furnished in this publication is PRELIMINARY and subject to
changes without notice.
66 of 90
The voltage divider R1/R2 shall interconnected to the FB (feedback pin) in that way that the
electromagnetic coupling to the wire interconnected to the SW pin is low as possible.
In order to achieve an optimal heat distribution form the IC to the environment it is strongly
recommended to place via’s underneath the QFN package. An example as regards this PCB design
detail is illustrated in Figure 4.4 (2-layer PCB example). Please refer to applications notes of the
package manufacturer AMKOR for more details how to place cooling via’s underneath the IC package
(please visit the link mentioned in chapter 8, [4]).
Figure 4.4 PCB Layout Recommendations
ZIOL2401
AUX_EN
AUX_TX
WURQ
RX
TX
TX_EN
INT_L
RST_L
M_EN
SW
FB
VDD
COM_O
VSS
LR_IN
LR_OUT
COM_I
AUX_O
L1
R1
R2
C1
C3
C5
D1
C4
Vout = 5V
DC_RDY
AUX_I
AUX_RX
C2
D1
L1
D1
L1
C2
C1
R2/R1
ZIOL
2401
C6
C5
C6
C3
D1
Schottky Diode
TMMBAT42
L1
10µH
(close to pin 21 of ZIOL2401)
R1
38.3KW
( DC/DC converter output
R2
12.4KW
voltage Vout = 5V )
C1
10µF / 10V (low ESR)
C2
100nF
C3
10µF / 10V (low ESR)
C4
100nF
C5
10µF / 50V (low ESR)
C6
100nF
C6
C6
C5
C1
C3
C4
Application
Example
2-layer PCB
4-layer PCB



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