| Electronic Components Datasheet Search |
|
SP4251 Datasheet(PDF) 4 Page - SIPAT Co,Ltd |
|
|
|||||||||||||||||||||||||||||
SP4251 Datasheet(HTML) 4 Page - SIPAT Co,Ltd |
|
4 / 8 page ![]() Product Specification SP4251 Page 4 of 8 Evaluation Kit Figure 4. Evaluation Board Layouts Figure 5. Evaluation Board Schematic NOTES: 4.3 Er AND 2.1MIL Cu THICKNESS. 3. ALL TRANSMISION LINES ARE: 33MIL WIDTH, 10MIL GAPS, 28MIL CORE DIELECTRIC TO DAMAGE BY ELECTROSTATIC DISCHARGE (ESD) 2. CAUTION: 1. USE 101-0337-02 PCB. CONTAINS PARTS AND ASSEMBLIES SUSCEPTIBLE or GND R1 DNI C2 100pF 1 J3 SMASM 1 J4 SMASM 1 J5 SMASM 1 J2 SMASM C1 100pF 1 J6 SMASM 2 V1 1 V2 3 RFC 6 GNDS1 7 GNDS2 8 RF2 4 N/C 5 RF1 U1 MSOP 1 1 3 3 5 5 7 7 2 2 4 4 6 6 8 8 10 10 9 9 J1 HEADER 2 X 5 PIN R2 0 OHM R3 0 OHM The SPDT Switch Evaluation Kit board was designed to ease customer evaluation of the SP4251 SPDT switch. The RF common port is connected through a 50 Ω transmission line to the bottom SMA connector, J3. Port 1 and Port 2 are connected through 50 Ω transmission lines to two SMA connectors on either side of the board, J4 and J2. A through transmission line connects SMA connectors J5 and J6. This transmission line can be used to estimate the loss of the PCB over the environmental conditions being evaluated. The board is constructed of a two metal layer FR4 material with a total thickness of 0.0322”. The bottom layer provides ground for the RF transmission lines. The transmission lines were designed using a coplanar waveguide with ground plane model using a trace width of 0.033”, trace gaps of 0.010”, dielectric thickness of 0.028”, copper thickness of 0.0021” and ε r of 4.3. J1 provides a means for controlling the DC inputs to the device. The second-to-bottom lower right pin (J1-3) is connected to the device V1 input. The second-to-top upper right pin (J1-7) is connected to the device V2 input. Footprints for decoupling capacitors are provided on both V1 and V2 traces. It is the responsibility of the customer to determine proper supply decoupling for their design application. Removing these components from the evaluation board has not been shown to degrade RF performance. Tel: +86-23-62808818 Fax: +86-23-62805284 www.sipatsaw.com / sawmkt@sipat.com |
|
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |