EXCLUSIVE NORTH AMERICAN AGENT FOR

RF, MICROWAVE & OPTOELECTRONIC SEMICONDUCTORS

CALIFORNIA EASTERN LABORATORIES

• Headquarters • 4590 Patrick Henry Drive • Santa Clara, CA 95054-1817 • (408) 988-3500 • Telex 34-6393 • FAX (408) 988-0279

24-Hour Fax-On-Demand: 800-390-3232 (U.S. and Canada only)

• Internet: http://WWW.CEL.COM

08/06/2001

DATA SUBJECT TO CHANGE WITHOUT NOTICE

PS9601, PS9601L

RECOMMENDED SOLDERING CONDITIONS

INFRARED RAY REFLOW TEMPERATURE PROFILE

(1) Precautions in mounting the devices by infrared reflow soldering

•

Peak reflow temperature

235 ˚C or below (plastic surface temperature)

•

Reflow time

30 seconds or less (Time period during which the plastic surface temperature

is 210 ˚C

•

Number of reflows Processes

One

•

Flux

Rosin flux containing small amount of chlorine (The flux

with a max. chlorine content of 0.2 Wt % is recommended.)

(2) Precautions in mounting the devices in solder dip method

•

Temperature

260 ˚C or below

•

Time

10 seconds or less

•

Flux

Rosin group flux, where the amount of chloride component is small.

Time (s)

120 to 160

60 to 120 s

(pre-heat)

(Actual heat)

to 10 s

to 30 s

235

210

Peak Temperature 230 ºC

or Lower