V2

MASW-006102-13610

HMIC™ Silicon PIN Diode Switch

with Integrated Bias Network

• North America Tel: 800.366.2266 / Fax: 978.366.2266

• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300

• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298

Visit www.macom.com for additional data sheets and product information.

MA-COM Technical Solutions and its affiliates reserve the right to make changes to the

product(s) or information contained herein without notice.

6

ADVANCED:

Data Sheets contain information regarding a product MA-COM Technical Solutions is

considering for development. Performance is based on target specifications, simulated results, and/

or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY:

Data Sheets contain information regarding a product MA-COM Technical Solutions

has under development. Performance is based on engineering tests. Specifications are typical.

Mechanical outline has been fixed. Engineering samples and/or test data may be available.

Commitment to produce in volume is not guaranteed.

MASW-006102-13610

Chip Outline Drawing

1,2

Notes:

1.

Topside and backside metallization is gold , 2.5mm thick typical.

2.

Yellow areas indicate wire bonding pads

DIM

INCHES

MILLIMETERS

MIN

MAX

MIN

MAX

A

.1325

.1335

3.3655

3.3909

B

.1225

.1235

3.1115

3.1369

C

.0595

.0605

1.5113

1.5367

D

.0345

.0355

0.8763

0.9017

E

.0245

.0255

0.6223

0.6477

F

.0115

.0125

0.2921

0.3175

G

.0305

.0315

0.7747

0.8001

H

.0275

.0285

0.6985

0.7239

I

.0395

.0405

1.0033

1.0287

J

.0295

.0305

0.7493

0.7747

RF Bond Pads (J1-J7)

.016 X .005 REF.

0.4064 X 0.127 REF.

DC Bond Pads (B2-B5)

.005 X .005 REF.

.127 X .127 REF.

Thickness

0.005 REF.

0.127 REF.