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LP3000 Datasheet(PDF) 2 Page - Filtronic Compound Semiconductors

Part # LP3000
Description  2 W POWER PHEMT
PDF  2 Pages
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Manufacturer  FILTRONIC [Filtronic Compound Semiconductors]
Direct Link  http://www.filtronic.co.uk/
Logo FILTRONIC - Filtronic Compound Semiconductors

LP3000 Datasheet(HTML) 2 Page - Filtronic Compound Semiconductors

  LP3000 Datasheet HTML 1Page - Filtronic Compound Semiconductors LP3000 Datasheet HTML 2Page - Filtronic Compound Semiconductors  
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LP3000
2 W POWER PHEMT
Phone:
(408) 988-1845
http://
www.filss.com
Revised:
1/18/01
Fax:
(408) 970-9950
Email:
sales@filss.com
• ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Test Conditions
Min
Max
Units
Drain-Source Voltage
VDS
TAmbient = 22 ± 3 °C
12
V
Gate-Source Voltage
VGS
TAmbient = 22 ± 3 °C
-5
V
Drain-Source Current
IDS
TAmbient = 22 ± 3 °C
2xIDSS
mA
Gate Current
IG
TAmbient = 22 ± 3 °C
30
mA
RF Input Power
PIN
TAmbient = 22 ± 3 °C
1.2
W
Channel Operating Temperature
TCH
TAmbient = 22 ± 3 °C
175
ºC
Storage Temperature
TSTG
-65
175
ºC
Total Power Dissipation
PTOT
TAmbient = 22 ± 3 °C
6.0
W
Notes:
Operating conditions that exceed the Absolute Maximum Ratings could result in permanent damage to the device.
Power Dissipation defined as: PTOT ≡ (PDC + PIN) – POUT, where
PDC: DC Bias Power
PIN: RF Input Power
POUT: RF Output Power
Absolute Maximum Power Dissipation to be de-rated as follows above 25
°C:
PTOT= 6.0W – (0.040W/°C) x THS
where THS = heatsink or ambient temperature.
• HANDLING PRECAUTIONS
To avoid damage to the devices care should be exercised during handling. Proper Electrostatic
Discharge (ESD) precautions should be observed at all stages of storage, handling, assembly, and
testing. These devices should be treated as Class 1A (0-500 V). Further information on ESD control
measures can be found in MIL-STD-1686 and MIL-HDBK-263.
• ASSEMBLY INSTRUCTIONS
The recommended die attach is gold/tin eutectic solder under a nitrogen atmosphere.
Stage
temperature should be 280-290
°C; maximum time at temperature is one minute. The recommended
wire bond method is thermo-compression wedge bonding with 0.7 or 1.0 mil (0.018 or 0.025 mm)
gold wire. Stage temperature should be 250-260
°C.
• APPLICATIONS NOTES & DESIGN DATA
Applications Notes are available from your local Filtronic Sales Representative or directly from the
factory.
Complete design data, including S-parameters, noise data, and large-signal models are
available on the Filtronic web site.
All information and specifications are subject to change without notice.



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