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LP3000 Datasheet(PDF) 2 Page - Filtronic Compound Semiconductors |
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LP3000 Datasheet(HTML) 2 Page - Filtronic Compound Semiconductors |
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2 / 2 page ![]() Filtronic LP3000/LPV3000 Solid State 2W Power PHEMT Phone: (408) 988-1845 Internet: http://www.filtronicsolidstate.com Fax: (408) 970-9950 ABSOLUTE MAXIMUM RATINGS (25 °C) RECOMMENDED CONTINUOUS OPERATING LIMITS SYMBOL PARAMETER RATING 1 SYMBOL PARAMETER RATING 2 VDS Drain-Source Voltage 12V VDS Drain-Source Voltage 8V VGS Gate-Source Voltage -5V VGS Gate-Source Voltage -1V IDS Drain-Source Current 2 x IDSS IDS Drain-Source Current 0.8 x IDSS IG Gate Current 120 mA IG Gate Current 40 mA PIN RF Input Power 1.2 W PIN RF Input Power 600 mW TCH Channel Temperature 175 °C TCH Channel Temperature 150 °C TSTG Storage Temperature -65/175 °C TSTG Storage Temperature -20/50 °C PT Power Dissipation 6.0W 3,4 PT Power Dissipation 5.0 W 3,4 GXdB Gain Compression 8 dB NOTES: 1. Operating conditions that exceed the Absolute Maximum Ratings could result in permanent damage to the device. 2. Recommended Continuous Operating Limits should be observed for reliable device operation. 3. Power Dissipation defined as: PT ≡ (PDC + PIN) - POUT, where: PDC = DC bias power, POUT = RF output power, and PIN = RF input power. 4. Power Dissipation to be de-rated as follows: 5. Specifications subject to change without notice. Example #1 : VDS = 8V, IDS = 535 mA PIN = POUT = 0 dBm (quiescent condition): PT = PDC = 4.28W Max. continuous THS = 25°C Example #2: VDS = 8V, IDS = 535 mA PIN = 26.5 dBm POUT = 33.5 dBm PT = (4.28+0.45) - 2.24 = 2.49W Max. continuous THS = 88°C HANDLING PRECAUTIONS: PHEMT chips should be stored in a dry nitrogen environment until assembly. Care should be exercised during handling to avoid damage to the devices. Proper Electrostatic Discharge (ESD) precautions should be observed at all stages of storage, handling, assembly, and testing. These devices should be treated as Class 1A (0-500V), and further information on ESD control measures can be found in MIL-STD-1686 and MIL-HDBK-263. ASSEMBLY INSTRUCTIONS: The recommended die attach is gold/tin eutectic solder under a nitrogen atmosphere. Stage temperature should be 280- 290 °C; maximum time at temperature is 1 min. The recommended wire bond method is thermo-compression wedge bonding with 0.7 or 1.0 mil (0.018 or 0.025 mm) gold wire. Stage temperature should be 250-260 °C. APPLICATIONS NOTES AND DESIGN DATA: Applications Notes are available from your local FSS Sales Representative, or directly from the factory. Complete design data, including S-parameters, Noise data, and Large-Signal models, is available on 3.5” diskette, or may be down-loaded from our Web Page. Get Curtice Model DSS-027 WG 25 PT(W) 6.0 -40 mW/ °C 5.0 -40 mW/ °C 175 150 THS( °C) |
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