E-pHEMT MMIC

AE368

Korean Facilities : 82-31-250-5078 / rfsales@rfhic.com

All specifications may change without notice

US Facility : 919-677-8780 / sales@rfhicusa.com

13 / 14

Version 1.3

Package Dimensions (Type: SOIC-8)

Recommended Pattern

* Unit: mm[inch] | Tolerance ±0.2[.008]

Pin Description

Pin No

Function

Pin No

Function

1

GND

5

GND

2

Input

6

Output / Bias

3

NC

7

Output / Bias

4

GND

8

GND

Recommended Mounting Configuration

* Mounting Configuration Notes

1. Ground / thermal via holes are critical for the proper

performance of this device.

2. Add as much copper as possible to inner and outer layers

near the part to ensure optimal thermal performance.

3. Mounting screws can be added near the part to fasten the

board to a heatsink. Ensure that the ground / thermal via hole

region contacts

the heatsink.

4. Do not put solder mask on the backside of the PCB in the

region where the board contacts the heatsink.

5. RF trace width depends upon the PCB material and

construction.

6. Use 1 oz. Copper minimum.