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SF2109D Datasheet(PDF) 5 Page - RF Monolithics, Inc |
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SF2109D Datasheet(HTML) 5 Page - RF Monolithics, Inc |
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5 / 6 page ![]() www.RFM.com E-mail: info@rfm.com Page 5 of 6 ©2008 by RF Monolithics, Inc. SF2109D - 9/18/08 8-Terminal Ceramic Surface-Mount Case 3.8 X 3.8 mm Nominal Footprint SM3838-8 Case TOP VIEW BOTTOM VIEW 0.066 0.055 TYP. (1.68) (1.40) PCB Footprint Case Dimensions Dimension mm Inches Min Nom Max Min Nom Max A 3.6 3.8 4.0 0.142 0.150 0.157 B 3.6 3.8 4.0 0.142 0.150 0.157 C 1.05 1.20 1.35 0.041 0.047 0.053 D 0.95 1.10 1.25 0.037 0.043 0.049 E 0.90 1.00 1.10 0.035 0.040 0.043 F 0.50 0.60 0.70 0.020 0.024 0.028 G 2.39 2.54 2.69 0.090 0.100 0.110 H 1.40 1.75 2.05 0.055 0.069 0.080 Electrical Connections Connection Terminals Port 1 Differential Input 1, 2 Port 2 Differential Output 5, 6 Ground All Others Single Ended Operation Return is Ground Differential Operation Return is Hot Dot Indicates Pin 1 Materials Solder Pad Ter- mination Au plating 30 - 60 uInches (76.2-152 uM) over 80-200 uInches (203-508 uM) Ni. Lid Fe-Ni-Co Alloy Electroless Nickel Plate (8-11% Phospho- rus) 100-200 uInches Thick Body Al2O3 Ceramic Pb Free A 1 2 3 B 7 6 5 4 C H 7 6 5 4 E F G 1 2 3 8 8 D |
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