TMS570LS1114 datasheet(7/167 Pages) TI1

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TMS570LS1114

www.ti.com

SPNS188A – OCTOBER 2012 – REVISED SEPTEMBER 2013

TMS570LS1114 16- and 32-Bit RISC Flash

4.9

Device Memory Map

................................ 67

Microcontroller

.......................................... 1

4.10

Flash Memory

...................................... 73

1.1

Features

............................................. 1

4.11

Tightly-Coupled RAM Interface Module

............ 76

1.2

Applications

.......................................... 2

4.12

Parity Protection for Accesses to peripheral RAMs

1.3

Description

........................................... 3

4.13

On-Chip SRAM Initialization and Testing

........... 78

1.4

Functional Block Diagram

........................... 5

4.14

External Memory Interface (EMIF)

................. 80

Revision History

.............................................. 8

4.15

Vectored Interrupt Manager

........................ 88

Device Package and Terminal Functions

.......... 9

4.16

DMA Controller

..................................... 92

2.1

PGE QFP Package Pinout (144-Pin)

................ 9

4.17

Real Time Interrupt Module

........................ 94

2.2

ZWT BGA Package Ball-Map (337 Ball Grid Array)

4.18

Error Signaling Module

............................. 96

2.3

Terminal Functions

................................. 11

4.19

Reset / Abort / Error Sources

..................... 100

Device Operating Conditions

....................... 40

4.20

Digital Windowed Watchdog

...................... 103

3.1

Absolute Maximum Ratings Over Operating Free-

4.21

Debug Subsystem

................................. 104

Air Temperature Range,

............................ 40

Peripheral Information and Electrical

3.2

Device Recommended Operating Conditions

...... 40

Specifications

......................................... 109

3.3

Switching Characteristics over Recommended

5.1

Enhanced Translator PWM Modules (ePWM)

.... 109

Operating Conditions for Clock Domains

.......... 41

5.2

Enhanced Capture Modules (eCAP)

.............. 114

3.4

Wait States Required

............................... 41

5.3

Enhanced Quadrature Encoder (eQEP)

.......... 116

3.5

Power Consumption Over Recommended

5.4

Multi-Buffered 12bit Analog-to-Digital Converter

.. 118

Operating Conditions

............................... 42

5.5

General-Purpose Input/Output

.................... 129

3.6

Input/Output Electrical Characteristics Over

Recommended Operating Conditions

.............. 43

5.6

Enhanced High-End Timer (N2HET)

.............. 130

3.7

Output Buffer Drive Strengths

...................... 43

5.7

Controller Area Network (DCAN)

.................. 134

3.8

Input Timings

....................................... 44

5.8

Local Interconnect Network Interface (LIN)

....... 135

3.9

Output Timings

..................................... 45

5.9

Serial Communication Interface (SCI)

............ 136

3.10

Low-EMI Output Buffers

............................ 47

5.10

Inter-Integrated Circuit (I2C)

...................... 137

System Information and Electrical Specifications

5.11

Multi-Buffered / Standard Serial Peripheral Interface

............................................................. 48

..................................................... 140

4.1

Device Power Domains

............................ 48

Device and Documentation Support

............. 152

6.1

Device and Development-Support Tool

4.2

Voltage Monitor Characteristics

.................... 48

Nomenclature

..................................... 152

4.3

Power Sequencing and Power On Reset

.......... 50

6.2

Community Resources

............................ 153

4.4

Warm Reset (nRST)

................................ 52

6.3

Device Identification

............................... 154

4.5

............. 53

6.4

Module Certifications

.............................. 156

4.6

Clocks

.............................................. 56

Mechanical Data

...................................... 161

4.7

Clock Monitoring

.................................... 64

7.1

Thermal Data

...................................... 161

4.8

Glitch Filters

........................................ 66

7.2

Packaging Information

............................ 161

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