LM3501 datasheet(3/26 Pages) TI1

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LM3501

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SNVS230B – MAY 2004 – REVISED MAY 2005

AGND (pin A1): Analog ground pin. The analog ground pin should tie directly to the GND pin.

VIN (pin B1):Analog and Power supply pin. Bypass this pin with a capacitor, as close to the device as possible,

connected between the VIN and GND pins.

VOUT (pin C1):Source connection of internal PMOS power device. Connect the output capacitor between the

VOUT and GND pins as close as possible to the device.

VSW (pin C2):Drain connection of internal NMOS and PMOS switch devices. Keep the inductor connection close

to this pin to minimize EMI radiation.

GND (pin C3):Power ground pin. Tie directly to ground plane.

FB (pin B3):Output voltage feedback connection. Set the primary White LED network current with a resistor from

the FB pin to GND. Keep the current setting resistor close to the device and connected between the FB and

GND pins.

CNTRL (pin A3): Analog control of LED current. A voltage above 125 mV will begin to regulate the LED current.

Decreasing the voltage below 75 mV will turn off the LEDs.

SHDN (pin A2):Shutdown control pin. Disable the device with a voltage less than 0.3V and enable the device

with a voltage greater than 1.1V. The white LED current can be controlled using a PWM signal at this pin. There

is an internal pull down on the SHDN pin, the device is in a normally off state.

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1)

VIN

−0.3V to 7.5V

VOUT (LM3501-16)

(2)

−0.3V to 16V

VOUT (LM3501-21)

(2)

−0.3V to 21V

VSW

(2)

−0.3V to VOUT+0.3V

FB Voltage

−0.3V to 7.5V

SHDN Voltage

−0.3V to VIN+0.3V

CNTRL

−0.3V to 7.5V

Maximum Junction Temperature

150°C

Lead Temperature

(Soldering 10 sec.)

300°C

Vapor Phase

(60 sec.)

215°C

Infrared

(15 sec.)

220°C

ESD Ratings (3)

Human Body Model

2kV

Machine Model

200V

(1)

Absolute maximum ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions for which the

device is intended to be functional, but device parameter specifications may not be guaranteed. For guaranteed specifications and test

conditions, see the Electrical Characteristics.

(2)

This condition applies if VIN < VOUT. If VIN > VOUT, a voltage greater than VIN + 0.3V should not be applied to the VOUT or VSW pins.

(3)

The human body model is a 100 pF capacitor discharged through a 1.5 k

Ω resistor into each pin. The machine model is a 200 pF

capacitor discharged directly into each pin.

Operating Conditions

Junction Temperature

(1)

−40°C to +125°C

Supply Voltage

2.7V to 7V

(1)

The maximum allowable power dissipation is a function of the maximum operating junction temperature, TJ(MAX), the junction-to-ambient

thermal resistance,

θJA, and the ambient temperature, TA. See the Thermal Properties section for the thermal resistance. The maximum

allowable power dissipation at any ambient temperature is calculated using: PD (MAX) = (TJ(MAX) − TA)/θJA. Exceeding the maximum

allowable power dissipation will cause excessive die temperature.

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