Top View

A

B

C

D

E

Package Marking

Top View

XXYY

ZZZZ

Note: The actual physical placement of the package marking will vary from part to part. The package

PDUNLQJ ³;;´ GHVLJQDWHV WKH GDWH FRGH. ³<<´ LV D 16& LQWHUQDO FRGH IRU GLH WUDFHDELOLW\. Both will vary

considerably.

³====´ (placeholder until actual package ID is determined) identifies the device (part number,

option, etc.).

Bottom View

E

D

C

B

A

1

2

3

4

1

2

3

4

LM2756

D1A

D2A

D3A D4A

D53

I

2

C Control

Signals

D1B

SDIO

1 µF

1 µF

1 µF

1 µF

GND

D62

C1+

C1-

C2+

C2-

SCL

D1C

HWEN

GROUP A

GROUP B

GROUP C

Capacitors:

Murata GNM1M2R61C105ME18D 1 µF dual

capacitors, or 1 µF single capacitor equivalent

LM2756

SNVS504B – JULY 2007 – REVISED DECEMBER 2007

www.ti.com

Typical Application Circuit

Figure 1. Minimum Layout

Connection Diagram

Figure 2. 20 Bump micro SMD Package

2

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Product Folder Links: LM2756