LMH6612MASLASHNOPB datasheet(2/42 Pages) TI1

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LMH6611

ADC121S101

0.1 PF

10 PF

0.1 PF

10 PF

0.1 PF

0.01 PF

14.3 k:

0.1 PF

1 PF

GND

1.24 k:

1 nF

150 pF

549:

22:

390 pF

549:

1 PF

14.3 k:

5.6 PF

LMH6611, LMH6612

SNOSB00K – NOVEMBER 2007 – REVISED OCTOBER 2013

www.ti.com

DESCRIPTION (CONTINUED)

The amplifiers will operate on a 2.7V to 11V single supply or ±1.35V to ±5.5V split supply. The LMH6611 single

is available in 6-Pin SOT and has an independent active low disable pin which reduces the supply current to 120

µA. The LMH6612 is available in 8-Pin SOIC. Both the LMH6611 and LMH6612 are available in

−40°C to

+125°C extended industrial temperature grade.

Typical Application

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1) (2)

For input pins only

2000V

Human Body Model

For all other pins

2000V

ESD Tolerance(3)

Machine Model

200V

Charge Device Model

1000V

Supply Voltage (VS = V

+ – V−)

12V

Junction Temperature(4)

150°C max

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test

conditions, see the Electrical Characteristics.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(3)

Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of

JEDEC)Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).

(4)

The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is

PD = (TJ(MAX)) – TA)/ θJA. All numbers apply for packages soldered directly onto a PC Board.

Operating Ratings

(1)

Supply Voltage (VS = V

+ – V−)

2.7V to 11V

Ambient Temperature Range(2)

−40°C to +125°C

6-Pin SOT

231°C/W

Package Thermal Resistance (

θJA)

8-Pin SOIC

160°C/W

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test

conditions, see the Electrical Characteristics.

(2)

The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is

PD = (TJ(MAX)) – TA)/ θJA. All numbers apply for packages soldered directly onto a PC Board.

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