Subject to change without notice.

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FEATURES

MegaBright LED Performance

460 & 470nm

MB-8 – 8.0 mW min.

MB-10 - 10.0 mW min.

MB-12 - 12.0 mW min.

MB-14 - 14.0 mW min.

MB-16 - 16.0 mW min (460 nm)

505 nm - 6.0 mW min.

527 nm - 5.0 mW min.

Single Wire Bond Structure

Class 2 ESD Rating

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APPLICATIONS

White LEDs

LCD Backlighting Units

Outdoor LED Video Displays

Automotive Dashboard Lighting

Traffic Signals

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CxxxMB290-Sxx00

Cree’s MB™ Generation II series of MegaBright LEDs combine highly efficient InGaN materials with Cree’s

proprietary G•SiC® substrate to deliver superior price/performance for high-intensity LEDs. These LED chips have a

geometrically enhanced vertical chip structure to maximize light extraction efficiency and require only a single wire

bond connection. Sorted die kits provide die sheets conveniently sorted into wavelength and radiant flux bins. Cree’s

MB series chips are tested for conformity to optical and electrical specifications and the ability to withstand 1000V

ESD. These LEDs are useful in a broad range of applications such as outdoor full-motion LED video signs, automotive

lighting and white LEDs, yet can also be used in high-volume applications such as LCD backlighting. Cree’s MB series

chips are compatible with most radial and SMT LED assembly processes.

CxxxMB290-Sxx00 Chip Diagram

Top View

Bottom View

G•SiC LED Chip

300 x 300 μm

SiC Substrate

h = 250 μm

Backside

Metallization

Gold Bond Pad

112 μm Diameter

Die Cross Section

Cathode (-)

Anode (+)

Mesa (junction)

250 x 250 μm

InGaN