Thick Film Chip Resistors

( Lead-Free for RM series standard )

Halogen-Free

Document No.

TRM-XX0S002C

Revise Date

2014/06/23

page number

12/13

TA-I TECHNOLOGY CO., LTD

11. Recommend IR – Reflow profile : (solder : Sn96.5 / Ag3 / Cu0.5)

Profile Feature

Lead (Pb )-Free Assembly

Average ramp-up rate

(Tsmax to Tp)

3℃ / second max.

Preheat

150℃

200℃

60 -150 seconds

Time maintained above :

217℃

60-120 seconds

Peak Temperature (Tp)

260℃

Time within

5

0





℃

of actual Peak

10 seconds

Ramp-down Rate

6℃/second max.

Time 25℃ to Peak Temperature

8mimutes max.

Alloyed Re-flow times : 3 times

Remark : To avoid discoloration phenomena of chip on terminal electrodes,

please use N2 Re-flow furnace .

12. Storage Conditions:

Temperature: 5℃~35℃,Humidity:40%~75%