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L2293Q Datasheet(PDF) 9 Page - STMicroelectronics |
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L2293Q Datasheet(HTML) 9 Page - STMicroelectronics |
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9 / 13 page ![]() L2293Q Package mechanical data Doc ID 14899 Rev 3 9/13 4 Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. Note: 1 VFQFPN stands for thermally enhanced very thin profile fine pitch quad flat package no lead. Very thin profile: 0.80 < A ≤ 1.00 mm. 2 Details of terminal 1 are optional but must be located on the top surface of the package by using either a mold or marked features. Table 8. VFQFPN 5x5x1.0 32L pitch 0.50 Dim. Databook (mm) Min Typ Max A 0.80 0.85 0.95 b 0.18 0.25 0.30 b1 0.165 0.175 0.185 D 4.85 5.00 5.15 D2 3.00 3.10 3.20 D3 1.10 1.20 1.30 E 4.85 5.00 5.15 E2 4.20 4.30 4.40 E3 0.60 0.70 0.80 e0.50 L 0.30 0.40 0.50 ddd 0.08 |
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