WM1811A datasheet(325/328 Pages) WOLFSON

325 / 328 page

Production Data

WM1811A

PD, November 2013, Rev 4.1

325

PACKAGE DIMENSIONS

B: 80 BALL W-CSP PACKAGE 4.158 X 3.876 X 0.607 mm BODY, 0.40 mm BALL PITCH

CORNER

TOP VIEW

DETAIL 2

DETAIL 1

BOTTOM VIEW

NOTES:

1. PRIMARY DATUM -Z- AND SEATING PLANE ARE DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS.

2. THIS DIMENSION INCLUDES STAND-OFF HEIGHT ‘A1’, SILICON THICKNESS AND BACKSIDE COATING.

3. A1 CORNER IS IDENTIFIED BY INK/LASER MARK ON TOP PACKAGE.

4. BILATERAL TOLERANCE ZONE IS APPLIED TO EACH SIDE OF THE PACKAGE BODY.

5. ‘e’ REPRESENTS THE BASIC SOLDER BALL GRID PITCH.

6. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.

7. FOLLOWS JEDEC DESIGN GUIDE MO-211-C.

8. f1 = NOMINAL DISTANCE OF BALL CENTRE TO DIE EDGE X AXIS (AS PER POD) – APPLICABLE TO ALL CORNERS OF DIE.

9. f2 = NOMINAL DISTANCE OF DIE CENTRE TO DIE EDGE IN Y AXIS (AS PER POD) – APPLICABLE TO ALL CORNERS OF DIE.

DM095.B

0.172

3.600 BSC

3.876

3.200 BSC

0.400 BSC

4.158

Dimensions (mm)

Symbols

MIN

NOM

MAX

NOTE

0.607

0.367

0.383

0.399

0.641

0.573

0.202

0.232

0.022

0.262

0.338 BSC

0.279 BSC

4.133

3.851

4.183

3.901

0.06

SOLDER BALL

DETAIL 1

0.025 4 X

0.258

0.266

0.015

C AB

0.004

WM1811A Datasheet(PDF) 325 Page - Wolfson Microelectronics plc

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