WM8987 datasheet(58/59 Pages) WOLFSON

58 / 59 page

WM8987L

Production Data

PD Rev 4.0 August 2008

PACKAGE DIMENSIONS

DM043.F

FL: 28 PIN COL QFN PLASTIC PACKAGE 4 X 4 X 0.75 mm BODY, 0.45 mm LEAD PITCH

INDEX AREA

(D/2 X E/2)

TOP VIEW

NOTES:

1. DIMENSION b APPLIES TO METALLIZED TERMINAL AND IS MEASURED BETWEEN 0.15 mm AND 0.30 mm FROM TERMINAL TIP.

2. FALLS WITHIN JEDEC, MO-220, VARIATION VGGD-2.

3. ALL DIMENSIONS ARE IN MILLIMETRES.

4. THE TERMINAL #1 IDENTIFIER AND TERMINAL NUMBERING CONVENTION SHALL CONFORM TO JEDEC 95-1 SPP-002.

5. COPLANARITY APPLIES TO THE EXPOSED HEAT SINK SLUG AS WELL AS THE TERMINALS.

6. REFER TO APPLICATIONS NOTE WAN_0118 FOR FURTHER INFORMATION REGARDING PCB FOOTPRINTS AND QFN PACKAGE SOLDERING.

7. DEPENDING ON THE METHOD OF LEAD TERMINATION AT THE EDGE OF THE PACKAGE, PULL BACK (L1) MAY BE PRESENT.

8. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.

DETAIL 1

bbb M

BOTTOM VIEW

aaa

2 X

aaa

2 X

SEATING PLANE

DETAIL 2

0.08

ccc

SIDE VIEW

DETAIL 1

Datum

DETAIL 2

Terminal

tip

e/2

SEE DETAIL 2

Exposed lead

DETAIL 2

Dimensions (mm)

Symbols

MIN

NOM

MAX

NOTE

0.725

0.75

0.775

0.05

0.02

0.203 REF

0.28

0.18

4.00

0.45 BSC

0.40 REF

4.00

0.10

aaa

bbb

ccc

REF:

0.15

0.10

JEDEC, MO-220

Tolerances of Form and Position

0.23

0.100 REF

0.535 REF

0.100 REF

0.230 REF

0.05 REF

3.95

4.05

3.95

4.05

PIN 1

IDENTIFICATION

0.150MM SQUARE

0.275MM

WM8987 Datasheet(PDF) 58 Page - Wolfson Microelectronics plc

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