Pad Assignment

Chip size: 242 ´ 196 (mil)

2

* The IC substrate should be connected to VDD in the PCB layout artwork.

HT1626

3

April 21, 2000

OS C O

OS C I

VD D

VL C D

BZ

T1

T2

T3

CO M 0

CO M 1

CO M 2

CO M 3

CO M 4

IR Q

BZ

1

41

2

42

3

43

4

44

5

45

6

46

7

47

8

48

9

49

10

50

11

51

12

52

13

53

14

54

15

55

16

56

17

57

18

58

19

59

20

60

21

61

22

62

23

63

24

64

25

65

26

66

27

67

28

68

29

69

30

70

31

71

32

72

33

73

34

74

35

75

36

76

37

77

38

78

39

79

40

80

T4

(0 , 0 )