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HT1627 Datasheet(PDF) 5 Page - Holtek Semiconductor Inc

Part # HT1627
Description  RAM Mapping 64x16 LCD Controller for I/O C
PDF  17 Pages
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Manufacturer  HOLTEK [Holtek Semiconductor Inc]
Direct Link  http://www.holtek.com
Logo HOLTEK - Holtek Semiconductor Inc

HT1627 Datasheet(HTML) 5 Page - Holtek Semiconductor Inc

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Pad Description
Pad No.
Pad Name
I/O
Description
1
DATA
I/O Serial data input/output with pull-high resistor
2
VSS
¾ Negative power supply, Ground
3
OSCI
I
If the system clock comes from an external clock source, the ex-
ternal clock source should be connected to the OSCI pad.
4
VDD
¾ Positive power supply
5
VLCD
I
LCD operating voltage input pad.
6
IRQ
O Time base or Watchdog Timer overflow flag, NMOS open drain
output
7, 8
BZ, BZ
O 2kHz or 4kHz tone frequency output pair (Tri-state output
buffer)
9~12
T1~T4
I
Not connected
13~28
COM0~COM15 O LCD common outputs
29~92
SEG0~SEG63
O LCD segment outputs
93
CS
I
Chip selection input with pull-high resistor. When the CS is
logic high, the data and command read from or write to the
HT1627 are disabled. The serial interface circuit is also reset.
But if the CS is at logic low level and is input to the CS pad, the
data and command transmission between the host controller
and the HT1627 are all enabled.
94
RD
I
READ clock input with pull-high resistor. Data in the RAM of
the HT1627 are clocked out on the rising edge of the RD signal.
The clocked out data will appear on the data line. The host con-
troller can use the next falling edge to latch the clocked out data.
95
WR
I
WRITE clock input with pull-high resistor. Data on the DATA
line are latched into the HT1627 on the rising edge of the WR
signal.
Absolute Maximum Ratings
Supply Voltage..............................-0.3V to 5.5V
Storage Temperature.................-50°Cto125°C
Input Voltage................VSS-0.3V to VDD+0.3V
Operating Temperature ..............-25°Cto75°C
Note: These are stress ratings only. Stresses exceeding the range specified under ²Absolute Maxi-
mum Ratings² may cause substantial damage to the device. Functional operation of this de-
vice at other conditions beyond those listed in the specification is not implied and prolonged
exposure to extreme conditions may affect device reliability.
HT1627
5
April 21, 2000



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