HCNR200 datasheet(3/16 Pages) HP

3 / 16 page

1-420

Gull Wing Surface Mount Option #300

240

∆T = 115°C, 0.3°C/SEC

∆T = 100°C, 1.5°C/SEC

∆T = 145°C, 1°C/SEC

TIME – MINUTES

220

200

180

160

140

120

100

260

456789

(NOTE: USE OF NON-CHLORINE ACTIVATED FLUXES IS RECOMMENDED.)

Maximum Solder Reflow Thermal Profile

Regulatory Information

The HCNR200/201 optocoupler

features a 0.400" wide, eight pin

DIP package. This package was

specifically designed to meet

worldwide regulatory require-

ments. The HCNR200/201 has

been approved by the following

organizations:

Recognized under UL

1577, Component

Recognition Program,

FILE E55361

CSA

Approved under CSA

Component Acceptance

Notice #5, File CA

88324

BSI

Certification according

to BS415:1994;

(BS EN60065:1994);

BS EN60950:1992

(BS7002:1992) and

EN41003:1993 for Class

II applications

VDE

Approved according to

VDE 0884/06.92

(Available Option #050

only)

1.00 ± 0.15

(0.039 ± 0.006)

7° NOM.

12.30 ± 0.30

(0.484 ± 0.012)

0.75 ± 0.25

(0.030 ± 0.010)

11.00

(0.433)

11.15 ± 0.15

(0.442 ± 0.006)

9.00 ± 0.15

(0.354 ± 0.006)

1.3

(0.051)

12.30 ± 0.30

(0.484 ± 0.012)

6.15

(0.242)TYP.

0.9

(0.035)

PAD LOCATION (FOR REFERENCE ONLY)

1.78 ± 0.15

(0.070 ± 0.006)

4.00

(0.158)

MAX.

1.55

(0.061)

MAX.

2.54

(0.100)

BSC

DIMENSIONS IN MILLIMETERS (INCHES).

LEAD COPLANARITY = 0.10 mm (0.004 INCHES).

0.254

+ 0.076

- 0.0051

(0.010

+ 0.003)

- 0.002)

MAX.

HCNR200 Datasheet(PDF) 3 Page - Agilent(Hewlett-Packard)

HCNR200 Datasheet(HTML) 3 Page - Agilent(Hewlett-Packard)

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

Datasheet Download

Link URL