1-123

Note: Use of nonchlorine activated fluxes is highly recommended.

Maximum Solder Reflow Thermal Profile

240

∆T = 115°C, 0.3°C/SEC

0

∆T = 100°C, 1.5°C/SEC

∆T = 145°C, 1°C/SEC

TIME – MINUTES

220

200

180

160

140

120

100

80

60

40

20

0

260

12

3

456789

10

11

12

Regulatory Information

The HCPL-2200/2219 have been

approved by the following

organizations:

UL

Recognized under UL 1577,

Component Recognition

Program, File E55361.

CSA

Approved under CSA Component

Acceptance Notice #5, File CA

88324.

VDE

Approved according to VDE

0884/06.92. (HCPL-2219 Option

060 Only)

Insulation and Safety Related Specifications

Parameter

Symbol

Value

Units

Conditions

Min. External Air Gap

L(IO1)

7.1

mm

Measured from input terminals to output terminals,

(External Clearance)

shortest distance through air.

Min. External

L(IO2)

7.4

mm

Measured from input terminals to output terminals,

Tracking Path

shortest distance path along body.

(External Creepage)

Minimum Internal

0.08

mm

Through insulation distance, conductor to conductor,

Plastic Gap

usually the direct distance between the photoemitter

(Internal Clearance)

and photodetector inside the optocoupler cavity.

Tracking Resistance

CTI

200

V

DIN IEC 112/VDE 0303 Part 1

(Comparative

Tracking Index)

Isolation Group

IIIa

Material Group (DIN VDE 0110, 1/89, Table 1)

Option 300 - surface mount classification is Class A in accordance with CECC 00802.