W232

Document #: 38-07167 Rev. *E

Page 4 of 6

Absolute Maximum Ratings[1]

Stresses greater than those listed in this table may cause permanent damage to the device. These represent a stress rating only.

Operation of the device at these or any other conditions above those specified in the operating sections of this specification is not

implied. Maximum conditions for extended periods may affect reliability.

.

Parameter

Description

Rating

Unit

Voltage on any Pin with Respect to GND

–0.5 to +7.0

V

Storage Temperature

–65 to +150

°C

Operating Temperature

0 to +70

°C

Ambient Temperature under Bias

–55 to +125

°C

Power Dissipation

0.5

W

Parameter

Description

Test Condition

Min

Typ

Max

Unit

Supply Current

Unloaded, 100 MHz

200

mA

Input Low Voltage

0.8

V

Input High Voltage

2.0

V

Output Low Voltage

0.8

V

Output High Voltage

2.1

V

Input Low Current

50

μA

Input High Current

50

μA

Parameter

Description

Test Condition

Min

Typ

Max

Unit

Output Frequency

30-pF load[5]

25

140

MHz

Output Rise Time

0.8V to 2.0V, 30-pF load

2.1

ns

Output Fall Time

2.0V to 0.8V, 30-pF load

2.5

ns

Input Clock Rise Time[2]

4.5

ns

Input Clock Fall Time[2]

4.5

ns

CLK to FBIN Skew

Variation[3, 4]

–350

0

350

ps

Output to Output Skew All outputs loaded equally

–100

0

100

ps

Duty Cycle

30-pF load

43

50

58

%

PLL Lock Time

Power supply stable

1.0

ms

Jitter, Cycle-to-Cycle[5]

150

ps

Notes

1. Multiple Supplies: The voltage on any input or IO pin cannot exceed the power pin during power up. Power supply sequencing is NOT required.

2. Longer input rise and fall time degrades skew and jitter performance.

5. Production tests are run at 133 MHz.

6. For frequencies below 40 MHz, Cycle-to-Cycle Jitter degrades to 175 ps.

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