AD9501 datasheet(3/12 Pages) AD

3 / 12 page

REV. B

AD9501

–3–

ABSOLUTE MAXIMUM RATINGS

Positive Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V

Digital Input Voltage Range . . . . . . . . . . . . . . . –0.5 V to +VS

Trigger/Reset Input Voltage Range . . . . . . . . . . –0.5 V to +VS

Minimum RSET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

Digital Output Current (Sourcing) . . . . . . . . . . . . . . . 10 mA

Digital Output Current (Sinking) . . . . . . . . . . . . . . . . 50 mA

DIE LAYOUT AND MECHANICAL INFORMATION

MECHANICAL INFORMATION

Die Dimensions . . . . . . . . . . . . . . . . . . 89

¥ 153 ¥ 15 (±2) mils

Pad Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

¥ 4 mils

Metalization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Aluminum

Backing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . None

Substrate Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . Ground

Passivation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Oxynitride

Die Attach . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Gold Eutectic

Bond Wire . . . . . . . . 1.25 mil, Aluminum; Ultrasonic Bonding

or 1 mil, Gold; Gold Ball Bonding

Operating Temperature Range

AD9501JN/JP . . . . . . . . . . . . . . . . . . . . . . . . . 0

∞C to 70∞C

Storage Temperature Range . . . . . . . . . . . . –65

∞C to +150∞C

Junction Temperature

. . . . . . . . . . . . . . . . . . . . . . . . . 175

∞C

Lead Soldering Temperature (10 sec) . . . . . . . . . . . . . . 300

∞C

NOTES

1Absolute Maximum Ratings are limiting values, to be applied individually, and beyond which the serviceability of the circuit may be impaired. Functional operability

is not necessarily implied. Exposure to absolute maximum rating conditions for an extended period of time may affect device reliability.

2Typical thermal impedances: 20-lead plastic leaded chip carrier,

qJA = 73∞C/W; qJC = 29∞C/W. 20-lead plastic DIP, qJA = 65∞C/W; qJC = 26∞C/W.

ORDERING GUIDE

Device

Temperature

Description

Package Option

AD9501JN

∞C to 70∞C

20-Lead Plastic DIP

N-20

AD9501JP

∞C to 70∞C

20-Lead Plastic Leaded Chip Carrier

P-20A

AD9501JP-REEL

∞C to 70∞C

20-Lead Plastic Leaded Chip Carrier

P-20A

*N = Plastic DIP; P = Plastic Leaded Chip Carrier.

EXPLANATION OF TEST LEVELS

Test Level

100% production tested.

II. 100% production tested at 25

∞C, and sample tested at specified temperatures.

III. Sample tested only.

IV. Parameter is guaranteed by design and characterization testing.

V. Parameter is a typical value only.

VI. All devices are 100% production tested at 25

∞C. 100% production tested at temperature extremes for

extended temperature devices; sample tested at temperature extremes for commercial/industrial devices.

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