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CS82C37A Datasheet(PDF) 23 Page - Intersil Corporation |
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CS82C37A Datasheet(HTML) 23 Page - Intersil Corporation |
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23 / 23 page ![]() 4-214 All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification. Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see web site http://www.intersil.com Die Characteristics DIE DIMENSIONS: 148 x 159 x 19 ±1mils (3760- x 4040 x 525 µm) METALLIZATION: Type: SiAlCu Thickness: Metal 1: 8k Å ± 0.75kÅ Thickness: Metal 2: 12k Å ± 1.0kÅ GLASSIVATION: Type: Nitrox Thickness: 10k Å ± 3kÅ WORST CASE CURRENT DENSITY: 0.6 x 105 A/cm2 Metallization Mask Layout 82C37A 82C37A |
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